3D Semiconductor Packaging Market
3D Semiconductor Packaging Market Size, Share & Trends Analysis Report by Technology (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), and by Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication and Aerospace & Defense), Forecast Period (2024-2031) Update Available - Forecast 2025-2031
3D semiconductor packaging market is anticipated to grow at a considerable CAGR of 10.2% during the forecast period (2024-2031). An increased demand for 3D semiconductor packaging in microelectronic devices drives the growth in the 3D semiconductor packaging industry.The growing adoption of advanced packaging technology with improved efficiency, and less power consumption is the key factor supporting the growth of the market globally. The market players are also focusing on introducing 3D semiconductor packaging solutions that further bolster the market growth. For instance, in November 2023, Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced to building of an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.
Segmental Outlook
The global 3D semiconductor packaging market is segmented on the technology, material, and industry verticals. Based on the technology, the market is sub-segmented into 3D through silicon via, 3D package on package, 3D fan out based and 3D wire bonded. Based on the material, the market is sub-segmented into organic substrate, bonding wire, leadframe, encapsulation resin and ceramic package. Further, on the basis of industry verticals, the market is sub-segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication and aerospace & defense. Among the industry vertical, the electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in the development of 3D packaging integration to the next level by stacking multiple semiconductor dies on top of each other.
The 3D Through silicon via Sub-Segment is Anticipated to Hold a Considerable Share of the Global 3D Semiconductor Packaging Market
Among the technology, the 3D Through silicon via sub-segment is expected to hold a considerable share of the global 3D semiconductor packagingmarket. The segmental growth is attributed to the growing influence of the Through-Silicon Via (TSV) Structures in 3D Packages. TSVs are used to build 2.5D and 3D packages that contain multiple semiconductor dies. The structures enable vertical stacking without the edge wiring or wire bonding that was formerly used in stacked packages on organic substrates. For instance, in September 2022, EV Group (EVG) launched NanoCleave, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as 3D semiconductor advanced packaging.
Regional Outlook
The global 3D semiconductor packaging market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America. Among these, Asia-Pacific is anticipated to hold a prominent share of the market across the globe. Theincreased demand for compact electronic circuitry with the decreasing size of electronic devices for ease of access for users is a key contributor to the high share of the regional market.
Semiconductor Industry Value Added by Activity and Region 2021(%)
Source:Semiconductor Industry Association
Global 3D Semiconductor Packaging Market Growth, by Region 2024-2031
North America is Expected to Grow at a Considerable CAGR in the Global 3D Semiconductor Packaging Market
Among all regions, the North America regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to the increasing production of semiconductor components, the presence of a large consumer base for electronics products, the high penetration of smartphones among the young population and a strong R&D pipeline for the semiconductor industries drive the growth of the market in the region.The key market players include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Microchip Technology Inc., NVIDIA Corp. and others.
Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in the region. For instance, in November 2023, the National Institute of Standards and Technology (NIST) released an approximately $3 billion National Advanced Packaging Manufacturing Program. The program boosts U.S. advanced packaging capabilities for semiconductors.
Market Players Outlook
The major companies serving the 3D semiconductor packaging market include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Samsung Electronics Co., Ltd., United Microelectronics Corp., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in June 2023, Cadence Design Systems, Inc. expanded collaboration with Samsung Foundry to accelerate 3D-IC design development for integrity 3D-IC platform supports Samsung’s new 3D CODE standard, enabling designers to create a variety of advanced packaging technologies.
The Report Covers
- Market value data analysis of 2023 and forecast to 2031.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global 3D semiconductor packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market-entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
1. Report Summary
• Current Industry Analysis and Growth Potential Outlook
1.1. Research Methods and Tools
1.2. Market Breakdown
1.2.1. By Segments
1.2.2. By Region
2. Market Overview and Insights
2.1. Scope of the Report
2.2. Analyst Insight & Current Market Trends
2.2.1. Key Findings
2.2.2. Recommendations
2.2.3. Conclusion
3. Competitive Landscape
3.1. Key Company Analysis
3.2. Advanced Micro Devices, Inc.
3.2.1. Overview
3.2.2. Financial Analysis
3.2.3. SWOT Analysis
3.2.4. Recent Developments
3.3. Intel Corp.
3.3.1. Overview
3.3.2. Financial Analysis
3.3.3. SWOT Analysis
3.3.4. Recent Developments
3.4. Samsung Electronics Co., Ltd.
3.4.1. Overview
3.4.2. Financial Analysis
3.4.3. SWOT Analysis
3.4.4. Recent Developments
3.5. Key Strategy Analysis
4. Market Segmentation
4.1. Global 3D Semiconductor Packaging Market by Technology
4.1.1. 3D Through silicon via
4.1.2. 3D Package on Package
4.1.3. 3D Fan Out Based
4.1.4. 3D Wire Bonded
4.2. Global 3D Semiconductor Packaging Market by Material
4.2.1. Organic Substrate
4.2.2. Bonding Wire
4.2.3. Leadframe
4.2.4. Encapsulation Resin
4.2.5. Ceramic Package
4.3. Global 3D Semiconductor Packaging Market by Industry Vertical
4.3.1. Electronics
4.3.2. Industrial
4.3.3. Automotive & Transport
4.3.4. Healthcare
4.3.5. IT & Telecommunication
4.3.6. Aerospace & Defense
5. Regional Analysis
5.1. North America
5.1.1. United States
5.1.2. Canada
5.2. Europe
5.2.1. UK
5.2.2. Germany
5.2.3. Italy
5.2.4. Spain
5.2.5. France
5.2.6. Rest of Europe
5.3. Asia-Pacific
5.3.1. China
5.3.2. India
5.3.3. Japan
5.3.4. South Korea
5.3.5. Rest of Asia-Pacific
5.4. Rest of the World
6. Company Profiles
6.1. Amkor Technology
6.2. Analog Devices, Inc.
6.3. Cadence Design Systems, Inc.
6.4. GlobalFoundries
6.5. Indium Corp.
6.6. Micron Technology, Inc.
6.7. NVIDIA Corp.
6.8. Qualcomm Technologies, Inc.
6.9. Semiconductor Components Industries, LLC
6.10. Siliconware Precision Industries Co., Ltd.
6.11. SK HYNIX INC.
6.12. STMicroelectronics
6.13. Taiwan Semiconductor Manufacturing Company Ltd.
6.14. TEKTRONIX, INC.
6.15. Texas Instruments Inc.
6.16. Thermo Fisher Scientific Inc.
6.17. Tower Semiconductor
6.18. United Microelectronics Corp.
1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
18. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
20. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
21. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
22. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
23. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
24. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
25. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
26. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
27. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
28. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
29. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
30. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
31. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
32. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
34. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
35. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023 VS 2031 (%)
2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023 VS 2031 (%)
7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023 VS 2031 (%)
13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
18. GLOBAL 3D SEMICONDUCTOR PACKAGING AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
20. US 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
21. CANADA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
22. UK 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
23. FRANCE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
24. GERMANY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
25. ITALY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
26. SPAIN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
27. REST OF EUROPE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
28. INDIA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
29. CHINA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
30. JAPAN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
31. SOUTH KOREA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
32. REST OF ASIA-PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
