Chiplet market is anticipated to grow at a CAGR of 6.4% during the forecast period (2023-2030). a chiplet is a sub-processing unit that is typically controlled by an I/O controller chip within the same package. The concept of chiplet design involves a modular method for constructing processors. CPU manufacturers such as AMD and Intel Corporation use chiplet designs in their product lineups which enhance production efficiency through improved silicon yields. Higher yields and modular construction help to reduce waste when manufacturing high core count components. Using chiplets allows manufacturers to increase yields of chips over monolithic CPU designs where all pieces of a processing unit are built into a single piece of silicon.

Segmental Outlook 

The global chiplet market is segmented by type and end-user industry. By type, the market is sub-segmented into CP) chiplet, GPU chiplet, FPGA chiplet, ASIC chiplet, and memory chiplet. By end-user industry, the market is sub-segmented into automotive electronics, consumer electronics, industrial automation, healthcare, military, IT, and telecommunication. Among the end-users, the demand for chiplets is expected to grow in automotive electronics. The growth is primarily owing to the increasing demand for software-enabled use cases such as advanced driver assistance systems (ADAS), and infotainment systems. Additionally, growing technological advancements in automobiles and the growth of the global electric vehicles (EV) market is also driving demand for chiplets. According to the 2023 Global EV outlook by the International Energy Agency (IEA), the electric car market has seen exponential growth as sales exceeded 10 million in 2022. A total of 14% of all new cars sold were electric in 2022, up from around 9% in 2021 and less than 5% in 2020. In automobiles, chiplets offer multiple advantages over conventional monolithic chip designs. Their modular nature facilitates rapid customization and upgrades, leading to reduced development time and costs. This adaptability enables manufacturers to swiftly respond to shifting market trends and embrace technological breakthroughs. Additionally, car manufacturers (along with their tier 1 suppliers) gain greater flexibility in mixing and matching components from various subcontractors, eliminating the risk of vendor lock-in and fostering a more resilient, healthy, and dynamic supply chain. Considering the growing demand and advantages of using chiplets in automobiles, industries are also focusing on research and development and collaborations which is further driving demand. For instance, in May 2023, MediaTek partnered With NVIDIA to offer transform AI and accelerated computing solutions for automobiles. This collaboration will result in the development of automotive SoCs that incorporate NVIDIA GPU chiplets. These chiplets will be interconnected using an ultra-fast and coherent chiplet interconnect technology. Additionally, MediaTek will implement NVIDIA DRIVE OS, DRIVE IX, CUDA, and TensorRT software technologies on these new automotive SoCs to enable connected infotainment, in-cabin convenience, and safety features. This partnership is expected to expand the range of in-vehicle infotainment options available to automakers on the NVIDIA DRIVE platform.

The Demand for Chiplets Is Expected to Grow in the Information Technology (IT) and Telecommunications

In IT and telecommunications, with technological advancements, demand for higher processing power and performance is also growing. Using chiplets allows manufacturers to scale up performance by integrating multiple specialized chips into a single package. Chiplets can also be designed with specific power consumption profiles, allowing for more efficient use of energy and cost reduction. Additionally, growing use cases and research, and development activities in the chiplet industry are also driving demand for the overall chiplet industry. 

In the field of information technology and telecommunications, rapid technological progress has resulted in a growing need for enhanced processing capabilities and performance. The adoption of chiplets within this domain offers manufacturers a solution to augment system performance by integrating numerous specialized semiconductor chips into a unified package. These chiplets can be easily engineered to adhere to specific power consumption profiles, thereby affording a more judicious and economical use of energy resources. Also, the expanding array of applications and ongoing research and development in the chiplet industry drive overall growth and demand within this sector. For instance, in October 2023, TSMC's 2 nm manufacturing process is currently in development, and a Japanese company is making a chiplet-based CPU that incorporates the Arm Neoverse architecture. With the inclusion of customized chiplets, this novel chip can cater to diverse purposes while optimizing performance. Socionext, a Japanese provider of System-on-Chip (SoC) designs catering to various industries such as automotive, data centers, networks, and smart devices, unveiled a new 32-core Arm CPU that leverages chiplet technology. According to the company, this innovative approach is capable of delivering scalable performance ideally suited for deployment in hyperscale data centers and cutting-edge mobile infrastructures, including those designed to support 5G and 6G networks.

Regional Outlook

The global chiplet market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among the, the market is expected to grow significantly in the North American region owing to factors including the significant presence of semiconductor and end-user industries such as Intel Corp., Nvidia, and Texas Instruments among others. These players are focusing on adopting strategic initiatives and product launches. For instance, in November 2023, Mercury Systems, Inc., a technology firm specializing in providing essential processing power at the edge, disclosed a collaboration with the US Navy to establish manufacturing capabilities aimed at enabling the utilization of commercial photonics chiplets for enhancing edge processing in defense-related contexts.

In addition, over the past few years, the regional government is increasingly inclined towards the R&D activities in semiconductor industry is further propelling the market growth in North America. For instance, in 2022, the US government passed the CHIPS and Science Act which includes $52.0 billion in chip manufacturing incentives and research investments, as well as an investment tax credit for semiconductor manufacturing and semiconductor equipment manufacturing. According to the 2022 report of the Semiconductor Industry Association, the US semiconductor companies continue to invest roughly one-fifth of annual revenue in R&D amounting to $50.2 billion in 2021. 

Global Chiplet Market Growth by Region 2023-2030

The Chiplet Market is Expected to Grow Significantly in the Asia-Pacific Region

Among these, the demand for Chiplet solutions and services is expected to grow significantly in the Asia Pacific region. The region holds the highest share in production and sales of end-user industries such as automobiles, consumer electronics, IT, and telecommunications among others. According to the International Organization of Motor Vehicle Manufacturers, 4 out of the top countries are from Asia Pacific in terms of annual automobile production in 2022 which were China, Japan, India, and South Korea. Also, the region holds a significant share in the global semiconductor industry. According to the Semiconductor Industry Association, the Asia Pacific semiconductor industry has grown from $39.8 billion in 2001 to over $330.94 billion in 2022. Additionally, growing support for the chiplet and the semiconductor industry from regional governments is also driving the demand. For instance, in May 2023, India's Center for Development of Advanced Computing (C-DAC) announced that be working on a series of ARM-based CPUs including the flagship AUM chip. Also, in January 2023, China-based electronic design automation (EDA) company Empyrean Technology announced it to be working on research and development of chiplet-based advanced packaging as well as AI-based design automation.

Market Players Outlook

The major companies serving the global chiplet market are Ampere Computing, Inc., Taiwan Semiconductor Manufacturing Co., Ltd., Intel Corp., and Marvell Technology, Inc. among others. With growing demand, companies are working on R&D and collaboration to cater to the demand and stay competitive. For instance, in November 2022, Lam Research, a US-based semiconductor equipment manufacturer, acquired Semsysco, a company located in Austria, to enhance its chiplet packaging technology. This acquisition includes the integration of cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This encompasses support for fan-out panel-level packaging, a method in which chips or chiplets are cut from a large, rectangular substrate sheet significantly larger than a conventional silicon wafer. This approach allows chip manufacturers to improve yield and reduce waste.

The Report Covers

• Market value data analysis of 2022 and forecast to 2030.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the chiplet market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying ‘who-stands-where’ in the market.