Semiconductor & IC Packaging Market
Semiconductor & IC Packaging Market Size, Share & Trends Analysis Report By Type (Organic substrate, Bonding wires ,Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Thermal interface materials, Solder balls and Others), By Technology (Small outline package (SOP), Grid array (GA), Quad flat no-leads (QFN), Dual Flat No-leads (DFN), Quad flat packages (QFP) and Dual-in-line (DIP), by Packaging Platform (Flip Chip, System in a Package (SIP), 2.5D/3D, Embedded Die, Fan-in Wafer Level Packaging (FI-WLP) and Fan-out Wafer Level Packaging (FO-WLP), and by End-Users (Consumer Electronics, Automotive, Aerospace & defense, IT & Telecommunication, Healthcare, and Others) Forecast Period (2024-2031)
Semiconductor & IC Packaging market is anticipated to grow at a significant CAGR of 14.9% during the forecast period (2024-2031). The market growth is attributed to the growing adoption of miniaturization and advancement in semiconductor packaging. Advanced packaging techniques such as small outline package (SOP), grid array (GA), quad flat no-leads (QFN), dual flat no-leads (DFN), quad flat packages (QFP), and dual-in-line (DIP) provide enhanced performance and increased integration levels. Multiple devices (mechanical, semiconductor, or electrical) can be combined and packed as a single electronic device using advanced packaging techniques. Advanced packaging uses methods and procedures that are usually used at semiconductor fabrication facilities, in contrast to standard integrated circuit packaging.
Market Dynamics
Increasing Adoption of High-Performance Computing (HPC) and Artificial Intelligence (AI)
Using High-performance computing in semiconductor packaging enables effective scaling for teams focused on performance, capacity, and power efficiency in their chip designs. To accomplish these designs, new nodes, and innovative design techniques are employed. The next generation of AI and HPC chip innovation depends on advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding and innovative solutions like silicon photonics for improving system performance.
Increasing Demand for Heterogeneous Integration via Different Semiconductor Technologies
Heterogeneous integration combines chips with various process nodes and technologies. The use of this technology enables the sustenance of the advancements in semiconductor and electronic performance and expenses while also increasing functional density and lowering the cost per function. The integration of separately manufactured components to develop a higher-level assembly or system-in-package, that offers better overall functionality and improved operational characteristics can be made possible with advanced packaging. Any unit, including passive components and assembled packages for high-bandwidth memory, can be considered a component such units include micro electromechanical systems.
Market Segmentation
Our in-depth analysis of the global semiconductor & IC packaging market includes the following segments technology, packaging platform, and end-users.
- Based on the type, the market is sub-segmented into the organic substrate, bonding wires ,leadframes, encapsulation resins, ceramic packages, die attach materials, thermal interface materials, solder balls and others.
- Based on technology, the market is sub-segmented into Small Outline Package (SOP), Grid Array (GA), Quad Flat No-leads (QFN), Dual Flat No-leads (DFN), Quad Flat Packages (QFP) and Dual-in-line (DIP).
- Based on the packaging platform, the market is sub-segmented into the flip chip, system in a package (SIP), 2.5D/3D, embedded die, Fan-in Wafer Level Packaging (FI-WLP), and Fan-out Wafer Level Packaging (FO-WLP).
- Based on end-users, the market is sub-segmented into BFSI, healthcare and life sciences, retail, IT & telecommunication, government and defense, manufacturing, energy & utility, and others (automotive, education, agriculture).
System in a Package (SIP) is Projected to Emerge as the Largest Segment
Based on the packaging platform, the global semiconductor & IC packaging market is sub-segmented into flip chip, system in a package (SIP), 2.5D/3D, embedded die, Fan-in Wafer Level Packaging (FI-WLP) and Fan-out Wafer Level Packaging (FO-WLP). Among this System ina Package (SIP), the sub-segment is expected to hold the largest share of the market. The primary factor supporting the segment's growth includes increasing adoption of the SIP to create integrated packages containing multiple ICs and passive components, creating compact and high-performance devices. This technology has widespread adoption across various industries, including consumer electronics, automotive, aerospace, and medical devices. For instance, in June 2021, Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. collaborated to broaden semiconductor package design solutions and expertise for high-performance SIP development for the automotive and industrial IoT markets.
Consumer Electronics Sub-segment to Hold a Considerable Market Share
Based on end-users, the global semiconductor & IC packaging market is sub-segmented into consumer electronics, automotive, aerospace & defense, IT & telecommunication, healthcare, and others (energy and lighting). Among these, the consumer electronics sub-segment is expected to hold a considerable share of the market. The segmental growth is attributed to the increasing demand for consumer electronics such as tablets, wearable devices, low-end smartphones, and other connected consumer goods. Semiconductor packaging in consumer electronics allows for integrating functionalities that would otherwise require separate components, reducing the device's overall size while maintaining or enhancing its capabilities.
Regional Outlook
The global semiconductor & IC packaging market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia-Pacific), and the Rest of the World (the Middle East & Africa, and Latin America).
Increasing Adoption of Semiconductor & IC Packaging in Asia-Pacific
- In emerging economies such as China and India, the market of semiconductor & IC packaging is rapidly growing. The increasing demand for semiconductors in consumer electronics, automotive, aerospace & defense, IT & telecommunication drive market growth in the region.
- According to the Institute of Electrical and Electronics Engineers (IEEE), in March 2024, the government of India approved a major investment in semiconductor and electronics production. The Government announced three plants, one semiconductor fab, and two packaging and test facilities within 100 days. The government has approved 1.2 trillion INR ($14.4 billion) for the projects.
Semiconductor Industry Value Added By Packaging, Assembly & Test Activity and Region 2021 (%)
Source: Semiconductor Industry Association (SIA)
Global Semiconductor & IC Packaging Market Growth by Region 2024-2031
North America Holds Major Market Share
Among all the regions, North America holds a significant share owing to numerous prominent companies and semiconductor & IC packaging providers in the region. The growth is mainly attributed to the growing adoption of advanced semiconductor packaging for semiconductor devices. Integrated circuits (ICs) or chips, being the core of electronic devices, require safeguarding, connectivity, and support. Advanced semiconductor packaging provides the necessary mechanical stability, thermal management, and electrical connections to ICs. Furthermore, increasing government investment in semiconductor & IC packaging contributes to the regional market growth. According to the National Institute of Standards and Technology (NIST), in February 2024, CHIPS for America announced a funding opportunity to expand the US semiconductor packaging. The CHIPS for America program anticipates approximately $300.0 million in funding innovation across multiple technologies ranging from semiconductor-based to glass and organics. The Department of Commerce is overseeing $50.0 billion to revitalize the US semiconductor industry and strengthen the country’s economic and national security.
Market Players Outlook
*Note: Major Players Sorted in No Particular Order.
The major companies serving the global semiconductor & IC packaging market include Intel Corp., Micron Technology, Inc., NVIDIA Corp., Renesas Electronics Corp., and Taiwan Semiconductor Manufacturing Company Ltd., among others. The market players are increasingly focusing on business expansion and product development by applying strategies such as collaborations, mergers, and acquisitions to stay competitive in the market. For instance, in February 2024, HCLTech and Intel Foundry expanded collaboration to advance global semiconductor innovation. Intel Foundry’s advanced technologies and silicon-verified IPs in manufacturing and advanced packaging strengthen the delivery of innovative, accessible, and diverse solutions.
Recent Development
- In January 2024, Intel Corp., opened Fab 9, in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Intel’s breakthrough packaging technology, Foveros, which offers flexible options for combining multiple chips that are optimized for power, performance, and cost.
- In November 2023, Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced its plan to build an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2.0 billion and employ approximately 2,000 people at the new facility.
- In November 2022, according to the Center for Strategic & International Studies (CSIS), to drive the US leadership in the $30.4 billion advanced semiconductor packaging market, the CHIPS and Science Act, signed into law in August 2022, calls on the National Institute for Standards and Technology (NIST) to establish a National Advanced Packaging Manufacturing Program (NAPMP).
The Report Covers
- Market value data analysis of 2023 and forecast to 2031.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global semiconductor & IC packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market-entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
1. Report Summary
• Current Industry Analysis and Growth Potential Outlook
1.1. Research Methods and Tools
1.2. Market Breakdown
1.2.1. By Segments
1.2.2. By Region
2. Market Overview and Insights
2.1. Scope of the Report
2.2. Analyst Insight & Current Market Trends
2.2.1. Key Findings
2.2.2. Recommendations
2.2.3. Conclusion
3. Competitive Landscape
3.1. Key Company Analysis
3.2. NVIDIA Corp.
3.2.1. Overview
3.2.2. Financial Analysis
3.2.3. SWOT Analysis
3.2.4. Recent Developments
3.3. Renesas Electronics Corp.
3.3.1. Overview
3.3.2. Financial Analysis
3.3.3. SWOT Analysis
3.3.4. Recent Developments
3.4. Taiwan Semiconductor Manufacturing Company Ltd.
3.4.1. Overview
3.4.2. Financial Analysis
3.4.3. SWOT Analysis
3.4.4. Recent Developments
3.5. Key Strategy Analysis
4. Market Segmentation
4.1. Global Semiconductor & IC Packaging Market by Type
4.1.1. Organic substrate
4.1.2. Bonding wires
4.1.3. Leadframes
4.1.4. Encapsulation resins
4.1.5. Ceramic packages
4.1.6. Die attach materials
4.1.7. Thermal interface materials
4.1.8. Others (Solder Balls)
4.2. Global Semiconductor & IC Packaging Market by Technology
4.2.1. Small outline package (SOP)
4.2.2. Grid array (GA)
4.2.3. Quad flat no-leads (QFN)
4.2.4. Dual Flat No-leads (DFN)
4.2.5. Quad flat packages (QFP)
4.2.6. Dual-in-line (DIP)
4.3. Global Semiconductor & IC Packaging Market by Packaging Platform
4.3.1. Flip Chip
4.3.2. System in a Package (SIP)
4.3.3. 2.5D/3D
4.3.4. Embedded Die
4.3.5. Fan-in Wafer Level Packaging (FI-WLP)
4.3.6. Fan-out Wafer Level Packaging (FO-WLP)
4.4. Global Semiconductor & IC Packaging Market by End-Users
4.4.1. Consumer Electronics
4.4.2. Automotive
4.4.3. Aerospace & defense
4.4.4. IT & Telecommunication
4.4.5. Healthcare
4.4.6. Others (Energy and Lighting)
5. Regional Analysis
5.1. North America
5.1.1. United States
5.1.2. Canada
5.2. Europe
5.2.1. UK
5.2.2. Germany
5.2.3. Italy
5.2.4. Spain
5.2.5. France
5.2.6. Rest of Europe
5.3. Asia-Pacific
5.3.1. China
5.3.2. India
5.3.3. Japan
5.3.4. South Korea
5.3.5. Rest of Asia-Pacific
5.4. Rest of the World
5.4.1. Latin America
5.4.2. The Middle East & Africa
6. Company Profiles
6.1. Advanced Micro Devices, Inc.
6.2. Amkor Technology, Inc
6.3. Analog Devices, Inc.
6.4. Applied Materials, Inc.
6.5. ASML Holding N.V (ASML)
6.6. Broadcom Inc.
6.7. Infineon Technologies AG
6.8. Intel Corp.
6.9. Marvell Technology, Inc.
6.10. MediaTek Inc.
6.11. Micron Technology, Inc.
6.12. NXP Semiconductors N.V.
6.13. Qualcomm Technologies, Inc.
6.14. Samsung Electronics Co., Ltd.
6.15. Silicon Laboratories, Inc.
6.16. SK hynix Inc.
6.17. STMicroelectronics N.V.
6.18. Synaptics Inc.
6.19. Texas Instruments Inc.
1. GLOBAL SEMICONDUCTOR & IC PACKAGING MARKET RESEARCH AND ANALYSIS BY TYPE,2023-2031 ($ MILLION)
2. GLOBAL ORGANIC SUBSTRATE SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
3. GLOBAL Bonding wires SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
4. GLOBAL Leadframes SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
5. GLOBAL Encapsulation resinsSEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
6. GLOBAL Ceramic packagesSEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
7. GLOBAL Die attach materialsSEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
8. GLOBAL Thermal interface materialsSEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
9. GLOBAL OTHER SEMICONDUCTOR & IC PACKAGINGTYPE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
10. GLOBAL SEMICONDUCTOR & IC PACKAGING MARKET RESEARCH AND ANALYSIS BYTECHNOLOGY,2023-2031 ($ MILLION)
11. GLOBAL SMALL OUTLINE PACKAGE (SOP) IN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
12. GLOBAL GRID ARRAY (GA) IN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
13. GLOBAL QUAD FLAT NO-LEADS (QFN) IN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
14. GLOBAL DUAL FLAT NO-LEADS (DFN) IN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
15. GLOBAL QUAD FLAT PACKAGES (QFP) IN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
16. GLOBAL DUAL-IN-LINE (DIP) IN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
17. GLOBAL SEMICONDUCTOR & IC PACKAGING MARKET RESEARCH AND ANALYSIS BY PACKAGING PLATFORM,2023-2031 ($ MILLION)
18. GLOBAL FLIP CHIP SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
19. GLOBAL SYSTEM IN A PACKAGE (SIP) SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
20. GLOBAL 2.5D/3D SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
21. GLOBAL EMBEDDED DIE SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
22. GLOBAL FAN-IN WAFER LEVEL (FI-WLP) SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
23. GLOBAL FAN-OUT WAFER LEVEL (FO-WLP) SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
24. GLOBAL SEMICONDUCTOR & IC PACKAGING MARKET RESEARCH AND ANALYSIS BY END-USERS,2023-2031 ($ MILLION)
25. GLOBAL SEMICONDUCTOR & IC PACKAGING FOR CONSUMER ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
26. GLOBAL SEMICONDUCTOR & IC PACKAGING FOR AUTOMOTIVEMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
27. GLOBAL SEMICONDUCTOR & IC PACKAGING FOR AEROSPACE & DEFENSEMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
28. GLOBAL SEMICONDUCTOR & IC PACKAGING FOR IT & TELECOMMUNICATIONMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
29. GLOBAL SEMICONDUCTOR & IC PACKAGING FOR HEALTHCAREMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
30. GLOBAL SEMICONDUCTOR & IC PACKAGING FOR OTHEREND-USERS MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
31. GLOBAL SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
32. NORTH AMERICAN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
33. NORTH AMERICAN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BYTECHNOLOGY,2023-2031 ($ MILLION)
34. NORTH AMERICAN SEMICONDUCTOR & IC PACKAGING MARKET RESEARCH AND ANALYSIS BY PACKAGING PLATFORM,2023-2031 ($ MILLION)
35. NORTH AMERICAN SEMICONDUCTOR & IC PACKAGING MARKET RESEARCH AND ANALYSIS BY END-USERS,2023-2031 ($ MILLION)
36. EUROPEAN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
37. EUROPEAN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BYTECHNOLOGY,2023-2031 ($ MILLION)
38. EUROPEAN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY PACKAGING PLATFORM,2023-2031 ($ MILLION)
39. EUROPEAN SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY END-USERS,2023-2031 ($ MILLION)
40. ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
41. ASIA-PACIFICSEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BYTECHNOLOGY,2023-2031 ($ MILLION)
42. ASIA-PACIFICSEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY PACKAGING PLATFORM,2023-2031 ($ MILLION)
43. ASIA-PACIFICSEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY END-USERS,2023-2031 ($ MILLION)
44. REST OF THE WORLD SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
45. REST OF THE WORLD SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BYTECHNOLOGY, 2023-2031 ($ MILLION)
46. REST OF THE WORLD SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY PACKAGING PLATFORM,2023-2031 ($ MILLION)
47. REST OF THE WORLD SEMICONDUCTOR & IC PACKAGINGMARKET RESEARCH AND ANALYSIS BY END-USERS,2023-2031 ($ MILLION)
1. GLOBAL SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY TYPE,2023 VS 2031 (%)
2. GLOBAL ORGANIC SUBSTRATE SEMICONDUCTOR & IC PACKAGINGMARKET SHARE BY REGION, 2023 VS 2031 (%)
3. GLOBAL BONDING WIRES SEMICONDUCTOR & IC PACKAGINGMARKET SHARE BY REGION, 2023 VS 2031 (%)
4. GLOBAL LEADFRAMES SEMICONDUCTOR & IC PACKAGINGMARKET SHARE BY REGION, 2023 VS 2031 (%)
5. GLOBAL ENCAPSULATION RESINS SEMICONDUCTOR & IC PACKAGINGMARKET SHARE BY REGION, 2023 VS 2031 (%)
6. GLOBAL CERAMIC PACKAGES SEMICONDUCTOR & IC PACKAGINGMARKET SHARE BY REGION, 2023 VS 2031 (%)
7. GLOBAL DIE ATTACH MATERIALS SEMICONDUCTOR & IC PACKAGINGMARKET SHARE BY REGION, 2023 VS 2031 (%)
8. GLOBAL THERMAL INTERFACE MATERIALS SEMICONDUCTOR & IC PACKAGINGMARKET SHARE BY REGION, 2023 VS 2031 (%)
9. GLOBAL OTHER SEMICONDUCTOR & IC PACKAGINGTYPE MARKET SHARE BY REGION, 2023 VS 2031 (%)
10. GLOBAL SEMICONDUCTOR & IC PACKAGING MARKET SHARE BYTECHNOLOGY,2023 VS 2031 (%)
11. GLOBAL GRID ARRAY (GA)IN SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
12. GLOBAL QUAD FLAT NO-LEADS (QFN) IN SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
13. GLOBAL DUAL FLAT NO-LEADS (DFN) IN SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
14. GLOBAL QUAD FLAT PACKAGES (QFP)IN SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
15. GLOBAL DUAL-IN-LINE (DIP)IN SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
16. GLOBAL SEMICONDUCTOR & IC PACKAGINGMARKET SHAREBY PACKAGING PLATFORM,2023 VS 2031 (%)
17. GLOBAL FLIP CHIP SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
18. GLOBAL SYSTEM IN A PACKAGE (SIP)SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
19. GLOBAL 2.5D/3D SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
20. GLOBAL EMBEDDED DIE SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
21. GLOBAL FAN-IN WAFER LEVEL (FI-WLP) SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
22. GLOBAL FAN-OUT WAFER LEVEL (FO-WLP) SEMICONDUCTOR & IC PACKAGING MARKET SHARE BY REGION, 2023 VS 2031 (%)
23. GLOBAL SEMICONDUCTOR & IC PACKAGINGMARKET SHAREBY END-USERS,2023 VS 2031 (%)
24. GLOBAL SEMICONDUCTOR & IC PACKAGINGFOR CONSUMER ELECTRONICSMARKET SHARE BY REGION, 2023 VS 2031 (%)
25. GLOBAL SEMICONDUCTOR & IC PACKAGINGFOR AUTOMOTIVEMARKET SHARE BY REGION, 2023 VS 2031 (%)
26. GLOBAL SEMICONDUCTOR & IC PACKAGINGFOR AEROSPACE & DEFENSEMARKET SHARE BY REGION, 2023 VS 2031 (%)
27. GLOBAL SEMICONDUCTOR & IC PACKAGINGFOR IT & TELECOMMUNICATIONMARKET SHARE BY REGION, 2023 VS 2031 (%)
28. GLOBAL SEMICONDUCTOR & IC PACKAGINGFOR HEALTHCAREMARKET SHARE BY REGION, 2023 VS 2031 (%)
29. GLOBAL SEMICONDUCTOR & IC PACKAGINGFOR OTHER END-USERS MARKET SHARE BY REGION, 2023 VS 2031 (%)
30. US SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
31. CANADA SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
32. UK SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
33. FRANCE SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
34. GERMANY SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
35. ITALY SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
36. SPAIN SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
37. REST OF EUROPE SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
38. INDIA SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
39. CHINA SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
40. JAPAN SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
41. SOUTH KOREA SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
42. REST OF ASIA-PACIFIC SEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
43. LATIN AMERICASEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
44. MIDDLE EAST AND AFRICASEMICONDUCTOR & IC PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
