Wire Wedge Bonder Equipment Market
Wire Wedge Bonder Equipment Market & Trends Analysis Report by Material (Gold Wire Bonding, Copper Wire Bonding, and Aluminum Wire Bonding). by Shape (Ball Bonding, Wedge Bonding, and Flip-Chip Bonding), and by End-User (Aerospace and Defense, Consumer Electronics, Automotive, Energy, Telecommunications, and Others) Forecast Period (2022-2028) Update Available - Forecast 2024-2030
Wire wedge bonder equipment market is anticipated to grow at a CAGR of 3.0% during the forecast period. One of the prominent factors that fueled the market growth is the increasing modifications and advances in the manufacturing processes, coupled with the rising production of electronic products across the globe, and the advent of new chip packaging are the factors that droves the market revenue growth during the forecast period. Wedge bonder equipment provides electrical interconnects between a device chip and package using thin aluminum or gold wires, and is used to interconnect a broad range of technologies in various power semiconductor packages for several end-use industries such as automotive, industrial, and aerospace, among others. For instance, in august 2021, QP Technologies announced it has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. Adding these systems to the line enables to better address customer requirements for a wider range of substrate and chip types within core markets, as well as for new markets such as compact battery modules used in mobile and automotive applications.
Segmental Outlook
The global wire wedge bonder equipment market is segmented based on the material, shape, and end-user. Based on the material, the market is bifurcated into gold wire bonding, copper wire bonding, and aluminum wire bonding. Based on shape, the market is sub-segmented into ball bonding, wedge bonding, and flip-chip bonding. Based on end-user, the market is sub-divided into aerospace and defense, consumer electronics, automotive, healthcare, energy, telecommunications, and others.
Among the end-user, the automotive segment is expected to witness favorable growth in the global wire wedge bonder equipment market. The increasing demand for electric vehicles has created a need for better, more reliable interconnections that is able to handle extreme temperature ranges in addition to shock and vibration conditions over increasingly longer lifetimes. Moreover, the presence of key players in the market that adopt numerous strategies such as partnerships, expansion, and collaborations will further aid in the segment growth. In March 2021, Inseto along with Kulicke & Soffa Asterion has selected for integrating a large diameter wire/ribbon wedge bonder for use in the production of wide bandgap (WBG) semiconductor-based power modules and the assembly of battery packs. The Asterion plays a crucial role in two major electric vehicles (EV) projects in which CIL is extensively involved.
Regional Outlooks
The global wire wedge bonder equipment market is further segmented based on geography including North America (the US, and Canada), Europe (Italy, Spain, Germany, France, and Others), Asia-Pacific (India, China, Japan, South Korea, and Others), and the Rest of the World (the Middle East &Africa, and Latin America). The Asia-Pacific region has accelerated the growth of the global wire wedge bonder equipment market. The growth is mainly augmented owing to the increasing demand for electronic products, along with the presence of established and cutting-edge manufacturers in the region. As per IBEF.org, the electronic sector of India contributes around 3.4% of the country's GDP in 2021.
Global Wire Wedge Bonder Equipment Market Growth, by Region 2022-2028
The North American Region Expected to Attain a Significant Growth in the Global Wire Wedge Bonder Equipment Market
The North American region is expected to account for the largest revenue share in the global market owing to rapid advancements in the chip manufacturing process and increasing demand for consumer electronics which has boosted the demand for semiconductor packaging. In addition, North America is one of the largest producers and consumers of semiconductors owing to the increasing production of electronic components and is the largest market for OSAT. For instance, according to the Semiconductor Industry Association (SIA), US semiconductor sales totaled $ 193 billion in 2019, and SIA members accounted for nearly 95% of all US semiconductor industry sales. Moreover, as per the same source, the federal government has allotted $ 50 billion to an incentive program that enables the construction of 19 advanced fabs in the US for the next 10 years and increases the semiconductor capacity by 57%.
Market Players Outlook
The major companies serving the global wire wedge bonder equipment market include Amkor Technology, Toray Engineering Co. Ltd., Kulicke and Soffa Industries, Inc., NEO Tech., Palomar Technologies, Inc., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in June 2019, ASE, TSMC, Leti/ST Microelectronics, and some other companies described new developments in advanced IC packaging such as 3D, 2.5D, and fan-out technology, which supports high bandwidth memory (HBM).
The Report Covers
- Market value data analysis of 2021 and forecast to 2028.
- Annualized market revenues ($ million) for each market segment.
- Country-wise analysis of major geographical regions.
- Key companies operating in the global wire wedge bonder equipment market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
- Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
- Analysis of market entry and market expansion strategies.
- Competitive strategies by identifying ‘who-stands-where’ in the market.
1. Report Summary
• Current Industry Analysis and Growth Potential Outlook
1.1. Research Methods and Tools
1.2. Market Breakdown
1.2.1. By Segments
1.2.2. By Region
2. Market Overview and Insights
2.1. Scope of the Report
2.2. Analyst Insight & Current Market Trends
2.2.1. Key Findings
2.2.2. Recommendations
2.2.3. Conclusion
3. Competitive Landscape
3.1. Key Company Analysis
3.1.1. Overview
3.1.2. Financial Analysis
3.1.3. SWOT Analysis
3.1.4. Recent Developments
3.2. Key Strategy Analysis
4. Market Segmentation
4.1. Global Wire Wedge Bonder Equipment Market by Material
4.1.1. Gold Wire Bonding
4.1.2. Copper Wire Bonding
4.1.3. Aluminum Wire Bonding
4.2. Global Wire Wedge Bonder Equipment Market by Shape
4.2.1. Ball Bonding
4.2.2. Wedge Bonding
4.2.3. Flip-Chip Bonding
4.3. Global Wire Wedge Bonder Equipment Market by End-User
4.3.1. Aerospace and Defense
4.3.2. Consumer Electronics
4.3.3. Automotive
4.3.4. Healthcare
4.3.5. Energy
4.3.6. Telecommunications
4.3.7. Others
5. Regional Analysis
5.1. North America
5.1.1. United States
5.1.2. Canada
5.2. Europe
5.2.1. UK
5.2.2. Germany
5.2.3. Italy
5.2.4. Spain
5.2.5. France
5.2.6. Rest of Europe
5.3. Asia-Pacific
5.3.1. China
5.3.2. India
5.3.3. Japan
5.3.4. South Korea
5.3.5. Rest of Asia-Pacific
5.4. Rest of the World
6. Company Profiles
6.1. Amkor Technology
6.2. Toray Engineering Co. Ltd.
6.3. DIAS Automation
6.4. F&K delvotec Bondtechnik gmbh
6.5. Hesse GmbH
6.6. Hybond Inc.
6.7. JCET Group Co., Ltd.
6.8. Kulicke and Soffa Industries, Inc.
6.9. NEO Tech.
6.10. Palomar Technologies, Inc.
6.11. Powertech Technology Inc.
6.12. SHINKAWA Electric Co., Ltd.
6.13. TPT Wire Bonder GmbH & Co. KG
6.14. ULTRASONIC ENGINEERING Co., LTD.
6.15. West·Bond Inc
1. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2021-2028 ($ MILLION)
2. GLOBAL GOLD WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
3. GLOBAL COPPER WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
4. GLOBAL ALUMINIUM WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
5. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY SHAPE, 2021-2028 ($ MILLION)
6. GLOBAL BALL WEDGE WIRE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
7. GLOBAL WEDGE WIRE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
8. GLOBAL FLIP CHIP WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
9. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY END-USER, 2021-2028 ($ MILLION)
10. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR AEROSPACE AND DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
11. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR CONSUMER ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
12. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR AUTOMOTIVE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
13. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
14. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR ENERGY MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
15. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
16. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR OTHER END-USERS MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
17. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY REGION, 2021-2028 ($ MILLION)
18. NORTH AMERICAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
19. NORTH AMERICAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2021-2028 ($ MILLION)
20. NORTH AMERICAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY SHAPE, 2021-2028 ($ MILLION)
21. NORTH AMERICAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY END-USER, 2021-2028 ($ MILLION)
22. EUROPEAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
23. EUROPEAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2021-2028 ($ MILLION)
24. EUROPEAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY SHAPE, 2021-2028 ($ MILLION)
25. EUROPEAN WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY END-USER, 2021-2028 ($ MILLION)
26. ASIA-PACIFIC WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
27. ASIA-PACIFIC WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2021-2028 ($ MILLION)
28. ASIA-PACIFIC WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY SHAPE, 2021-2028 ($ MILLION)
29. ASIA-PACIFIC WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY END-USER, 2021-2028 ($ MILLION)
30. REST OF THE WORLD WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2021-2028 ($ MILLION)
31. REST OF THE WORLD WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2021-2028 ($ MILLION)
32. REST OF THE WORLD WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY SHAPE, 2021-2028 ($ MILLION)
33. REST OF THE WORLD WIRE WEDGE BONDER EQUIPMENT MARKET RESEARCH AND ANALYSIS BY END-USER, 2021-2028 ($ MILLION)
1. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET SHARE BY MATERIAL, 2021 VS 2028 (%)
2. GLOBAL GOLD WIRE WEDGE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
3. GLOBAL COPPER WIRE WEDGE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
4. GLOBAL ALUMINIUM WIRE WEDGE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
5. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET SHARE BY SHAPE, 2021 VS 2028 (%)
6. GLOBAL BALL WEDGE WIRE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
7. GLOBAL WEDGE WIRE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
8. GLOBAL BALL WEDGE WIRE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
9. GLOBAL FLIP CHIP WEDGE WIRE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
10. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET SHARE BY END-USER, 2021 VS 2028 (%)
11. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR AEROSPACE AND DEFENSE MARKET SHARE BY REGION, 2021 VS 2028 (%)
12. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR CONSUMER ELECTRONICS MARKET SHARE BY REGION, 2021 VS 2028 (%)
13. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR AUTOMOTIVE MARKET SHARE BY REGION, 2021 VS 2028 (%)
14. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR HEALTHCARE MARKET SHARE BY REGION, 2021 VS 2028 (%)
15. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR ENERGY MARKET SHARE BY REGION, 2021 VS 2028 (%)
16. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR TELECOMMUNICATION MARKET SHARE BY REGION, 2021 VS 2028 (%)
17. GLOBAL WIRE WEDGE BONDER EQUIPMENT FOR OTHER END-USER MARKET SHARE BY REGION, 2021 VS 2028 (%)
18. GLOBAL WIRE WEDGE BONDER EQUIPMENT MARKET SHARE BY REGION, 2021 VS 2028 (%)
19. US WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
20. CANADA WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
21. UK WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
22. FRANCE WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
23. GERMANY WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
24. ITALY WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
25. SPAIN WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
26. REST OF EUROPE WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
27. INDIA WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
28. CHINA WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
29. JAPAN WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
30. SOUTH KOREA WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
31. REST OF ASIA-PACIFIC WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
32. REST OF THE WORLD WIRE WEDGE BONDER EQUIPMENT MARKET SIZE, 2021-2028 ($ MILLION)
