Global 3D NAND flash memory market is anticipated to grow at a significant CAGR of 19.4% during the forecast period (2024-2031). 3D NAND flash memory is a storage technology that stacks memory cells vertically, allowing for higher data density, improved performance, and increased reliability in electronic devices such as smartphones and SSDs (Solid State Drives).
The growth of the 3D NAND flash memory market is fueled by increasing demand for high-density storage solutions across industries such as consumer electronics, data centers, and automotive. Technological advancements have led to improved manufacturing processes, yielding higher output and reduced production costs, enhancing the economic feasibility of 3D NAND flash memory. Its adoption is further propelled by the rising popularity of smartphones, tablets, and SSDs, given its superior performance, reliability, and energy efficiency. Moreover, the expanding use of Artificial Intelligence (AI), Machine Learning (ML), and the Internet of Things (IoT) necessitates robust storage solutions capable of managing vast amounts of data. The 3D NAND Flash Memory market is positioned for sustained growth as it continues to meet the escalating need for efficient, high-capacity storage solutions across diverse sectors.
Browse the full report description of “3D NAND Flash Memory Market Size, Share & Trends Analysis Report by Type (Single-level Cell, Multi-level Cell, and Triple-level Cell), by Application (Camera, Laptops and PCs, Smartphones & Tablets, and Others), and by End User (Automotive, Consumer Electronics, Enterprise, Healthcare, and Others) Forecast Period (2024-2031)” at https://www.omrglobal.com/industry-reports/3d-nand-flash-memory-market
In March 2023, Kioxia and Western Digital introduced their latest 3D flash memory technology, offering high capacity, performance, and reliability. Leveraging advanced scaling and wafer bonding, the eighth-generation BiCS FLASH achieves industry-leading bit density through a collaborative engineering effort. Innovative processes and architectures reduce costs while enhancing lateral scaling advancements. The 218-layer 3D flash memory features 1Tb TLC and QLC with four planes, promising improved performance across various applications.
In August 2022, SK Hynix unveiled 238-layer TLC NAND flash memory at the Flash Memory Summit 2022, promising improved density, capacity, and bandwidth. Leveraging advanced scaling and wafer bonding technologies, the new NAND is set to enter mass production in H1'2023, initially targeting consumer SSDs, smartphones, and high-capacity server SSDs. The technology introduces ONFi 5.0 support for enhanced performance and power efficiency. Samples have been shipped to customers, with plans for 1Tbit 238L NAND later in 2023.
Market Coverage
• The market number available for – 2023-2031
• Base year- 2023
• Forecast period- 2024-2031
• Segment Covered-
o By Type
o By Application
o By End User
• Regions Covered-
o North America
o Europe
o Asia-Pacific
o Rest of the World
• Competitive Landscape- HP Inc., Intel Corp., Samsung Electronics Co., Ltd., SK Hynix, Inc., and Toshiba Corp. among others.
Key questions addressed by the report
Global 3D NAND Flash Memory Market Report Segment
By Type
By Application
By End User
Global 3D NAND Flash Memory Market Report Segment by Region
North America
• United States
• Canada
Europe
• UK
• Germany
• Italy
• Spain
• France
• Rest of Europe
Asia-Pacific
• China
• India
• Japan
• South Korea
• Rest of Asia-Pacific
Rest of the World
• Latin America
• Middle East & Africa
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