The global 3D stacking is anticipated to grow at a considerable CAGR of 18.7% during the forecast period. The growing miniaturization of electronic devices is one of the key factors which is driving the market growth. 3D stacking technology can be used to create smaller and more portable electronic devices without sacrificing performance. For example, it helps in creating high-density memory chips that are smaller and more lightweight. 3D stacking technology can also be used to create high-performance processors that are smaller and more lightweight. The development of smaller and more powerful semiconductor chips has enabled the development of new medical devices, such as implantable heart monitors, and pacemakers. These devices can be implanted in the body to monitor and regulate vital signs without sacrificing patient comfort.
Browse the full report description of “3D Stacking Market Size, Share & Trends Analysis Report Market by Type (Stacked 3D and Monolithic 3D), by Component (Through-silicon via (TSV), Through glass-via (TGV), and Silicon interposer), by Application (Logic, Memory, Imaging and Optoelectronics, and Others), and by End-User (Consumer Electronics, Telecommunications, Medical Devices, Military and Aerospace, and Others), Forecast Period (2023-2030)” at https://www.omrglobal.com/industry-reports/3d-stacking-market
Similarly, another prominent example of the growing miniaturization of electronic devices is the wearable device. Wearable devices, such as smartwatches and fitness trackers, have become increasingly popular in recent years. These devices are small and lightweight enough to be worn on the body, but they are still powerful enough to perform a variety of tasks, such as tracking fitness data, displaying notifications, and making payments.
For instance, in June 2023, Toshiba Electronic Devices & Storage Corp. launched “TPH3R10AQM,” a 100V N-channel power MOSFET fabricated with Toshiba’s latest-generation process, U-MOS X-H. The product targets applications such as switching circuits and hot swap circuits[1] on the power lines of industrial equipment used for data centers and communications base stations.
Market Coverage
• The market number available for – 2022-2030
• Base year- 2022
• Forecast period- 2023-2030
• Segment Covered-
o By Type
o By Component
o By Application
o By End-User
• Regions Covered-
o North America
o Europe
o Asia-Pacific
o Rest of the World
• Competitive Landscape- includes ASE Technology Holding Co, Ltd., Intel Corp., Samsung Electronics Co., Ltd., and SK hynix Co., Ltd., among others.
Key questions addressed by the report
• What is the market growth rate?
• Which segment and region dominate the market in the base year?
• Which segment and region will project the fastest growth in the market?
• Who is the leader in the market?
• How players are addressing challenges to sustain growth?
• Where is the investment opportunity?
Global 3D Stacking Market Report Segment
By Type
By Component
By Application
By End-User
Global 3D Stacking Market Report Segment by Region
North America
• United States
• Canada
Europe
• UK
• Germany
• Italy
• Spain
• France
• Rest of Europe
Asia-Pacific
• China
• India
• Japan
• South Korea
• Rest of Asia-Pacific
Rest of the World
• Latin America
• Middle East & Africa
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