The global heat sink (Heat Exchanger) market is anticipated to grow at a considerable CAGR of 6.8% during the forecast period (2024-2031). The increasing demand for high-performance electronics with miniaturized designs necessitates efficient thermal management solutions. This coincides with the rising power density of electronic components, leading to a greater need for effective heat dissipation. Furthermore, the expansion of sectors like cloud data centers, electric vehicles, and the Internet of Things (IoT) fuels the market's growth as these applications heavily rely on reliable heat dissipation to ensure optimal performance and component longevity.
Browse the full report description of “Heat Sink Market Size, Share & Trends Analysis Report by Material (Aluminum, Copper, and Others), by Applications (Computer Processors, LED Lighting, Automotive Industry, Aerospace Industry, Consumer Electronics, and Others), and by Type (Active, Passive, and Hybrid) Forecast period (2024-2031)” at https://www.omrglobal.com/industry-reports/heat-sink-market
Recent Launches-
In October 2023, Thermal right launch two new M.2 SSD heat sinks: the HR-10 2280 PRO and the HR-10 2280 PRO BLACK. The release is slated for October 2023.The HR-10 2280 PRO heatsink features four ?5mm heat pipes that are designed to efficiently disperse heat from the SSD throughout its surface. It has a 30mm fan that is 10mm thick, which helps to improve its thermal management skills and keeps the M.2 SSD cool.
In September 2023, ATS, Inc's new picoHEX compact heat exchangers feature a compact design for liquid cooling deployment in small spaces for AI, CPU, GPU, FPGA and more. PicoHEX heat exchangers are small, powerful heat exchangers that can effectively cool CPUs, GPUs, AI processors, FPGAs, and other high-power components through liquid cooling. Three types of the new picoHEX exchangers are available: the ATS-PHEX-100, PHEX-101, and PHEX-102. Heat transfer performance varies from 5W to 15W per ?T = 1°C depending on the model. While the bigger PHEX-100 and -101 each have two fans, the smaller PHEX-102 has an integrated blower.
In May 2023, Avnet’s new heatsink for the AMD-Xilinx Kria K26 adaptive system on modules (SOMs) is the only off-the-shelf solution specifically designed for these SOMs and it is available now. The heatsink from Avnet attaches straight to the heat spreader plate that is included with the K26 SOM. This solution is "turnkey" since the interface "gap" material is preloaded on the heat sink and mounting hardware is included.
Market Coverage
• The market number available for – 2023-2031
• Base year- 2023
• Forecast period- 2024-2031
• Segment Covered-
o By Material
o By Applications
o By Type
• Regions Covered-
o North America
o Europe
o Asia-Pacific
o Rest of the World
• Competitive Landscape- includes CeramTec GmbH, CTS Corp., KULR TECHNOLOGY GROUP, INC., Sensata Technologies, Inc., SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD, and TE Connectivity Ltd. among others.
Key questions addressed by the report
Global Heat Sink Market Report Segment
By Material
By Applications
By Type
Global Heat Sink Market Report Segment by Region
North America
• United States
• Canada
Europe
• UK
• Germany
• Italy
• Spain
• France
• Rest of Europe
Asia-Pacific
• China
• India
• Japan
• South Korea
• Rest of Asia-Pacific
Rest of the World
• Latin America
• Middle East & Africa
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