Global semiconductor & IC packaging market is anticipated to grow at a significant CAGR of 14.9% during the forecast period (2024-2031). The market growth is attributed to the increasing demand of the consumer electronics, growing miniaturization and densification in the electronic sector and adoption of emerging technologies such as 5G and autonomous vehicles. Government support with funds helps various R&D projects and facilitates access to essential semiconductor infrastructure and resources to drive innovation and enhance local talent development. For instance, in June 2023, Micron Technology, Inc. announced plans to build a new semiconductor assembly and test facility in India with an investment of $825.0 million over the two phases of the project. The investment for both phases is up to $2.7 billion under the government's modified assembly, testing, marking, and packaging (ATMP) Scheme.
Browse the full report description of “Semiconductor & IC Packaging Market Size, Share & Trends Analysis Report By Type (Organic substrate, Bonding wires ,Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Thermal interface materials, Solder balls and Others), By Technology (Small outline package (SOP), Grid array (GA), Quad flat no-leads (QFN), Dual Flat No-leads (DFN), Quad flat packages (QFP) and Dual-in-line (DIP), by Packaging Platform (Flip Chip, System in a Package (SIP), 2.5D/3D, Embedded Die, Fan-in Wafer Level Packaging (FI-WLP) and Fan-out Wafer Level Packaging (FO-WLP), and by End-Users (Consumer Electronics, Automotive, Aerospace & defense, IT & Telecommunication, Healthcare, and Others) Forecast Period (2024-2031)” at https://www.omrglobal.com/industry-reports/semiconductor-and-ic-packaging-market
Increasing semiconductor manufacturing packaging approach provides customers with access to an efficient, localized, and secure supply of semiconductors through a dedicated production facility For instance, In December 2023, Pragmatic Semiconductor announced that it had completed the first close of its Series D funding round, securing an investment of £162.0 million ($201.5 million). The investment enables Pragmatic to accelerate its expansion plans in the UK to meet the growing demand for its unique packaging technology from customers globally.
Market Coverage
• The market number available for – 2023-2031
• Base year- 2023
• Forecast period- 2024-2031
• Segment Covered-
o By Type
o By Technology
o By Packaging Platform
o By End-Users
• Regions Covered-
o North America
o Europe
o Asia-Pacific
o Rest of the World
• Competitive Landscape- Intel Corp., Micron Technology, Inc., NVIDIA Corp., Renesas Electronics Corp., Taiwan Semiconductor Manufacturing Company Ltd.among others.
Key questions addressed by the report.
Global Semiconductor & IC Packaging Market Report Segment
By Type
By Technology
By Packaging Platform
By End-Users
Global Semiconductor & IC Packaging Market Report Segment by Region
North America
• United States
• Canada
Europe
• UK
• Germany
• Italy
• Spain
• France
• Rest of Europe
Asia-Pacific
• China
• India
• Japan
• South Korea
• Rest of Asia-Pacific
Rest of the World
• Latin America
• Middle East & Africa
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