Speak To Analyst Semiconductor & IC Packaging Market Size, Share & Trends Analysis Report By Type (Organic substrate, Bonding wires ,Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Thermal interface materials, Solder balls and Others), By Technology (Small outline package (SOP), Grid array (GA), Quad flat no-leads (QFN), Dual Flat No-leads (DFN), Quad flat packages (QFP) and Dual-in-line (DIP), by Packaging Platform (Flip Chip, System in a Package (SIP), 2.5D/3D, Embedded Die, Fan-in Wafer Level Packaging (FI-WLP) and Fan-out Wafer Level Packaging (FO-WLP), and by End-Users (Consumer Electronics, Automotive, Aerospace & defense, IT & Telecommunication, Healthcare, and Others) Forecast Period (2024-2031)